Wherever defects are expensive and quality is non-negotiable, our AOI, SPI and X-ray systems keep SMT lines stable and yields high — across the industries that build the world's most critical electronics.
We're best suited for companies running active SMT production lines and focused on improving performance and quality. These are the sectors where our inspection technology delivers the most value.
Contract manufacturers run many different jobs at once. Fast changeovers with AI-assisted programming, high throughput and flexibility across products — with inspection as the quality guarantee to their customers.
ECUs, sensors, ADAS modules and EV power electronics demand a zero-defect mindset. Solder joints must survive heat, vibration and years of service — so hidden joints under BGAs get the scrutiny they need.
SiP, flip-chip and advanced packaging push feature sizes ever smaller. Micro-scale placement and hidden interconnects demand high-resolution 3D AOI and X-ray to verify what the eye can't see.
In medical devices and diagnostics, failure isn't an option. Full traceability, IPC Class 3 standards and 100% inspection of critical joints — with the repeatability and documentation that audits require.
5G infrastructure, networking gear and RF modules push density to the limit. Fine-pitch components and high-frequency boards call for precise solder-paste inspection plus accurate 3D AOI of every placement.
High-volume consumer products live and die by yield and speed. Lines need fast, reliable inspection that keeps throughput high and defects out — without slowing the pace of production.
Mini LED and micro LED assembly means tens of thousands of tiny placements per board. It takes high-resolution 3D AOI to catch missing, shifted or tombstoned LEDs at this density and scale.
Control systems, drives, automation and power electronics built to run for years. Rugged designs and mixed technology (THT + SMT) — covered by both AOI and conformal coating inspection.
Inspection isn't only for the SMT line. The same technology that catches defects after reflow also supports back-end assembly, advanced packaging and final-product verification — wherever solder joints, components and coatings need to be checked.
Whatever you build, we help you find the right system and dial in the process — from selection through integration to ongoing optimization.
Tell us what you build and how you build it — we'll help you find the right inspection strategy.