High-accuracy 3D solder paste inspection after SMT screen printing. Intelligent zero-reference-point technology ensures precise measurement even on deformed PCBs — intercepting the majority of defect-forming factors at the front of the line.
Magic-ray 3D SPI-Icon series are designed for 3D solder paste inspection after SMT screen printing — catching paste defects before they become expensive post-reflow rework.
Ensures accurate measurement especially on PCB board deformation — the leading cause of false SPI readings.
Perfect combination ensures effective detection of solder bridging, solder breakage, icicle, and other paste defects.
Flexible choices of multiple optical options deliver industry-leading inspection speed and performance.
Effective on PCBs with different color variations — automatically adjusts inspection specifications for black and white boards.
Fast programming can be achieved with or without Gerber files, reducing changeover time on high-mix lines.
Process optimization through SPC data analysis helps continuously improve process quality and yield.
Icon SPI is the front end of Magic-ray's three-point-check iFactory solution — connecting SPI, pre-reflow AOI, and post-reflow AOI for root-cause defect analysis.
Intuitive, data-rich feature provides the statistical information required for quality improvement on production lines.
Set defect criteria to monitor abnormal conditions in real time, providing quick feedback and overall quality control.
Effectively inspects gold-finger contamination and defects before reflow, preventing defects flowing to the next station.
Prevents unauthorized individuals from bypassing key inspection locations — ensures control over critical points.
Connects SPI, pre-reflow AOI, and post-reflow AOI for data collection to quickly locate the root cause of defects.
Remote review station affords real-time monitoring of multiple lines, remote reassessment, and centralized management.
Icon Series is available in two configurations: Icon+ (single-lane) and Icon-D+ (dual-lane).
| Specification | Icon+ | Icon-D+ |
|---|---|---|
| Image System | ||
| Camera | 12MP industrial camera | |
| Resolution | 5.5µm, 10µm, 12µm, 15µm | |
| Height resolution | 0.37µm | |
| Lighting | 3-color ring-shape LED (RGB) | |
| Height measurement | Projectors | |
| Movement Structure | ||
| X/Y movement | AC Servo | |
| Platform | Granite | |
| Width adjustment | Automatic | |
| Transport type | Belt | |
| Board loading direction | Left → right or right → left (select at point of order) | |
| Fixed rail | Front rail | 1st rail (1st & 3rd fixed rail or 1st & 4th fixed rail) |
| Hardware Configuration | ||
| Operating system | Windows 11 | |
| Communication | Ethernet, SMEMA | |
| Power requirement | Single phase 220V, 50/60Hz, 5A | |
| Air requirement | 0.4–0.6 MPa | |
| Conveyor height | 900 ± 20mm | |
| Equipment dimensions | L1000 × D1360 × H1620mm (without tower light) | |
| Equipment weight | 950 kg | 1000 kg |
| Board Handling | ||
| PCB size | 50 × 50 – 510 × 610mm | Dual lane: 50 × 50 – 510 × 320mm Single lane: 50 × 50 – 510 × 580mm |
| Clamping edge | 3mm | |
| Maximum pad height | 600µm | |
| Minimum pad spacing | 100µm (within height of 150µm) | |
| Max. solder paste inspection size | 20 × 20mm | |
| Min. solder paste inspection size | 0.1mm | |
| GR&R | ≤ 10% | |
| Inspection Functions | ||
| Defects detected | Icicle, insufficient solder, excess solder, average height, offset, solder bridge, odd shape, exposed copper, gold finger, etc. | |
| Inspection speed | 400–450ms / FOV | |
| Service & Support (NETA Trading) | ||
| US distributor | NETA Trading LLC · Lake Bluff, IL | |
| Installation & training | On-site installation, commissioning, and operator training | |
| Live demo | Lake Bluff, Chicago area, IL | |
Configuration and specifications subject to change — contact us to confirm for your line.
The Icon SPI sits right after the printer — catching solder paste defects before the mounter places components. Suitable for SMT, Mini LED, and SiP-SMT lines.
The Icon SPI sits immediately after the solder-paste printer — catching paste defects before the mounter places components, where rework is cheapest.
Standard front-end inspection for high-mix and high-volume SMT assembly lines — printer, SPI, mounter, reflow, and post-reflow AOI.
With the 12MP, 5.5µm lens option, the Icon inspects 20–50µm solder paste and meets the demands of 100,000+ solder pads per board.
Fits System-in-Package SMT lines that add die bonders and a washing machine — providing reliable paste inspection ahead of fine-pitch placement.
Tell us about your current line and defect priorities — we'll recommend the right Icon configuration.
