One 2D inline AOI platform, configured for every stage of the line. Built on a shared granite base with telecentric optics and 4-color RGBW lighting, the V5000 Series spans SMT inspection (V5000), top-sided wave-soldering AOI (V5100), inverted-camera post-wave inspection (V5200), and double-sided AOI (V5300) — all aligned to IPC standards with full SPC analytics.
Every model in the V5000 Series shares the same granite base, telecentric optics, RGBW lighting, and IPC-aligned 2D algorithm — so what changes is where it sits in your line, not how it inspects.
High-precision, high-speed AOI for both pre-reflow and post-reflow on the SMT line — placement, polarity, and solder-joint quality on rigid PCB and FPC.
Pre-reflow & post-reflow Details in specifications below Download datasheet
Top-side inspection before and after wave soldering — abundant algorithms for SMT, wave-solder, and odd-shape components, with belt or wheel drive for oversized boards.
Pre- & post-wave (top side) Details in specifications below Download datasheet
Bottom-mounted camera inspects post-wave solder joints without flipping the board — saving floor space and improving overall line efficiency. Pulley conveyor resists heat and dirt.
Post-wave (bottom side) Details in specifications below Download datasheetThe fourth member of the series inspects the top and bottom of a PCBA simultaneously in a single pass — a one-stop final-inspection station.
The V5000 combines a stable granite platform, telecentric optics, and a powerful inspection algorithm to deliver consistent, repeatable results — fully automatic inline AOI for SMT assembly and solder-joint quality.
A granite base and telecentric lens keep magnification constant across the field of view — stable, distortion-free imaging that holds its accuracy run after run.
A mature, multi-feature algorithm delivers reliable solder-joint and component inspection — catching real defects while keeping false calls low on dense, high-mix boards.
Automatic compensation for board warpage and high-temperature deformation makes the V5000 just as suitable for FPC as it is for rigid PCB.
One platform covers inspection both before and after reflow — verify placement and polarity early, then confirm final solder-joint quality on the finished board.
Abundant SPC data analysis turns inspection results into process insight — track trends, flag drift early, and continuously improve process quality.
Wrong component, missing, polarity, misalignment, reverse, IC lead bend, tombstone, and the full range of solder-joint defects — covered in a single pass.
The V5000 Series inspects the defects that drive most assembly returns — placement, polarity, and solder-joint quality across SMT and odd-shape components on both rigid PCB and FPC.
From fine-pitch chips and ICs to connectors and odd-shape components, the V5000 verifies presence, alignment, polarity, and solder quality in a single inline pass.
The V5000 Series pairs a stable mechanical platform with mature optical algorithms aligned to IPC standards — multi-level positioning, automatic warpage compensation, and SPC analytics work together for reliable, repeatable inline inspection.
A mature multi-feature algorithm delivers reliable solder-joint inspection — strong detection of bridging, insufficient and excess solder, and opens across a wide component range.
The telecentric lens keeps magnification constant regardless of object position — reducing the impact of board warpage and producing consistent, measurable images.
PCB, FOV, and solder-pad level positioning work together to compensate for board deformation — reducing false calls and escapes for higher detection accuracy.
Detection parameters are calculated against IPC-A-610 criteria — component side-overhang, shift rate, and solder coverage are judged to a recognized, repeatable standard.
Abundant SPC analytics give real-time visibility into process quality — operators see trends and abnormal conditions early and act before defects flow downstream.
Automatic compensation for thermally deformed boards lets the V5000 inspect flexible circuits and high-temperature PCBs with the same reliability as rigid boards.
The V5000 is also offered as a V5000D dual-lane configuration, and each model has an XL variant with a larger inspection envelope. For double-sided inspection, see the V5300 page.
| Specification | V5000 · SMT | V5100 · Top Wave | V5200 · Inverted |
|---|---|---|---|
| Image System | |||
| Camera | 5MP / 12MP industrial camera | ||
| Resolution | 5MP: 15µm, 10µm 12MP: 15, 12, 10, 6.3µm | 5MP: 24µm; 12MP: 15µm | 5MP: 24µm; 12MP: 15µm |
| FOV | 37 × 30mm (5MP, 15µm) 60 × 45mm (12MP, 15µm) | 60 × 49mm (5MP, 24µm) 60 × 45mm (12MP, 15µm) | 60 × 49mm (5MP, 24µm) 60 × 45mm (12MP, 15µm) |
| Lens | Telecentric lens | ||
| Lighting | 4-color ring-shape LED (RGBW) | ||
| Movement Structure | |||
| Variants | V5000 · V5000D (dual-lane) · V5000XL | V5100 · V5100XL | V5200 · V5200XL |
| X/Y movement | AC servo · dual-drive on XL variants | ||
| Platform | Granite | ||
| Width adjustment | Automatic | ||
| Transport type | Belt | Belt (roller pulley optional) | Roller pulley |
| Board loading | Left to right or right to left (select at point of order) | ||
| Hardware Configuration | |||
| Operating system | Windows 10 | ||
| Communication | Ethernet, SMEMA | ||
| Power requirement | Single phase 220V, 50/60Hz, 5A | ||
| Air requirement | 0.4–0.6 MPa | ||
| Conveyor height | 900 ± 20mm | 900 ± 20mm (740 optional) | 900 ± 20mm (740 optional) |
| Equipment dimensions (mm) | L935 × D1360 × H1570 | L1045 × D1470 × H1600 | L1045 × D1470 × H1600 |
| Equipment weight | 900 kg (V5000D 950 kg · XL 1100 kg) | 700 kg (XL 850 kg) | 700 kg (XL 850 kg) |
| PCB Handling | |||
| PCB size (mm) | 50 × 60 – 510 × 610 V5000D dual-lane: 50 × 60 – 510 × 320 · single: 510 × 580 | 50 × 50 – 510 × 510 | 50 × 50 – 510 × 510 |
| PCB thickness | 0.6 – 6.0mm | ≤ 6.0mm | — |
| PCB weight | ≤ 3 kg | ≤ 8 kg (roller ≤ 20 kg) | ≤ 30 kg |
| Component clearance | Top 25–60mm adj. · Bottom 45mm | Top 25–85mm · Bottom 25–80mm | Top 120mm · Bottom 25–50mm adj. |
| Clamping edge | 3.0mm | ||
| Inspection | |||
| Components | Wrong component, missing, polarity, shift, reverse, damage, IC lead bend, foreign material, tombstone, etc. | ||
| Solder joint | No solder, insufficient solder, open solder, excess solder, solder bridge, blowhole, solder ball, etc. | ||
| Inspection component | Chip: 03015 and above · LSI: 0.3mm pitch and above · Others: odd-shape component | ||
| Inspection speed | 180–200 ms / FOV | ||
| Service & Support (NETA Trading) | |||
| US distributor | NETA Trading LLC · Lake Bluff, IL | ||
| Installation & training | On-site installation, commissioning, and operator training | ||
| Live demo | Lake Bluff, Chicago area, IL | ||
Configuration and specifications subject to change — contact us to confirm for your line.
Each configuration targets a different inspection point — SMT placement and reflow, top-side wave soldering, and post-wave joints from below. Together they cover the whole assembly process.
Pre-reflow after placement and post-reflow on the finished board — presence, polarity, alignment, and final solder-joint quality on the SMT line.
Top-side inspection before and after wave soldering — SMT, wave-solder, and odd-shape components, with belt or wheel drive for oversized boards.
Inverted bottom camera inspects post-wave solder joints without flipping the board — saving floor space and improving overall line efficiency.
The fourth configuration inspects both sides of the PCBA at once — final inspection in a single pass. View the V5300 page.
Tell us about your line and the boards you run — we'll help you pick the right V5000 Series configuration (and XL where needed) for your board sizes, throughput, and inspection points.
