One machine inspects the top and bottom of a PCBA at the same time — SMT and through-hole, in a single pass. Proprietary solder-pad & FOV positioning and a dedicated CPU-pin algorithm catch the defects that wave soldering leaves behind, while replacing two single-sided systems and the operators that watch them.
The V5300 was designed around one job: catching top- and bottom-side defects on populated boards, fast, with minimal operator involvement.
Both sides of the PCBA are inspected in one pass, simplifying the process and replacing two single-sided machines — saving floor space and operators.
An optional pulley-type conveyor handles heavy PCBAs up to 30 kg and boards still hot from a wave-soldering machine, resisting high temperature and dirt.
Big-data and AI deep-learning identify components and program inspection in one click, minimizing the training and skill required to run the system.
Magic-ray's proprietary solder-pad and full-FOV assisted positioning algorithm locates components accurately, even on boards deformed after wave soldering.
A dedicated algorithm for pins accurately captures pin bending, deformation and missing pins — the hard-to-see THT defects that matter most.
Centralized AOI management enables remote judgement, offline programming and real-time debugging updates — taking operators off the line entirely.
The V5300 inspects component presence and placement on the top side and solder-joint quality on the bottom side — in the same cycle. It catches the full range of post-wave defects across both technologies.
Real inspection imagery from the V5300 platform — across SMT components, through-hole solder joints, and final-assembly sockets.
One-click AI programming maps the full field of view and locates every component and pin automatically, reducing manual setup to minutes.
Pad-based and full-FOV positioning keeps inspection accurate even when boards warp or shift after the wave-soldering process.
Multi-color RGBW lighting renders components clearly for presence, polarity, offset and part-correctness checks across mixed boards.
A powerful wave-soldering algorithm inspects manually or machine-inserted THT joints for fillet, voids, open solder and copper exposure.
The bottom-side camera captures the full pin field, flagging bridges, solder balls, splash and insufficient solder across the whole board.
With up to 120 mm top clearance, the V5300 inspects CPU sockets and bent pins in server and computing final assembly.
V5300 is available as V5300 (standard) and V5300XL (larger inspection area for bigger boards).
| Specification | V5300 | V5300XL |
|---|---|---|
| Image System | ||
| Camera | 5MP / 12MP industrial camera | |
| Resolution | 5MP: 24µm · 12MP: 15µm | |
| FOV | 60×49mm (5MP) · 60×45mm (12MP) | |
| Lens | Telecentric lens | |
| Lighting | 4-color ring shape LED (RGBW) | |
| Movement Structure | ||
| X/Y movement | AC Servo | AC Servo (Dual Drive) |
| Width adjustment | Automatic | |
| Transport type | Belt (roller pulley optional) | |
| Board direction | L→R or R→L (select at order) | |
| Hardware Configuration | ||
| Operating system | Win 10 | |
| Communication | Ethernet, SMEMA | |
| Power | Single phase 220V, 50/60Hz, 5A | |
| Air | 0.4–0.6 MPa | |
| Conveyor height | 900±20mm (740±20mm optional) | |
| Weight | 900 kg | 1000 kg |
| Dimensions | L1045×D1470×H1600mm | L1200×D1470×H1600mm |
| PCB Size | ||
| Board size | 50×50 – 510×510mm | 50×50 – 650×610mm |
| PCB weight | ≤10 kg (≤30 kg roller pulley) | |
| Thermotolerance | ≤60°C (≤150°C roller pulley) | |
| Thickness | 0.6–6mm (≤6.0mm roller pulley) | |
| Component clearance | Top 25–85mm · Bottom 25–80mm | |
| Inspection | ||
| Component defects | Wrong, missing, polarity, misalignment, reverse, IC lead bend, foreign material, tombstone | |
| Solder defects | No/insufficient/open/excess solder, bridge, blowhole, solder ball | |
| Min. component | Chip 03015 and above; LSI 0.3mm pitch and above | |
| Inspection speed | 200–250 ms/FOV | |
| Configuration and specifications subject to change — contact us to confirm for your line. Roller-pulley conveyor recommended for boards coming directly off a wave-soldering machine. | ||
The V5300 sits right after wave soldering and at final inspection, covering both stages on one flexible platform.
Placed immediately after the wave-soldering machine, the V5300 inspects SMT and THT joints on both sides while boards are still hot — catching defects at the source.
At final inspection, double-sided coverage of PCBA and finished goods feeds a centralized management system for remote judgement and offline programming.
Send us your board details and defect priorities — we'll evaluate sample boards and arrange a demo in the US.
