Highly efficient and easy double-sided 3D AOI for both SMT and THT inspection. A brand-new optical imaging system reconstructs realistic 3D images of components, inspecting top and bottom of the PCBA simultaneously with synchronous positioning, an ultra-high 35mm measurement range, and specialized DIP solder joint algorithms — ideal for post-wave-soldering and double-sided final inspection.
VS7300 uses a brand-new optical imaging system for realistic and efficient reconstruction of 3D images of components — purpose-built for post-wave soldering and double-sided final inspection.
Synchronous positioning of upper and lower parts with asynchronous interlocking for image retrieval — complete double-sided detection in a single pass, saving factory space.
High-speed 12MP / 21MP industrial cameras and dedicated motion-control cards deliver industry-leading inspection speed (450–550 ms/FOV) and long-term stability.
Up to 35mm height range with dual-sided Z-axes — suitable for wave soldering production lines and effective inspection of THT floating height defects.
Rich feature algorithms flexibly satisfy both SMT and THT inspection demands — combining 3D measurement, AI-driven analysis, and color feature extraction.
Accurate measurement of pin height and effective inspection of defects like missing pins or no protrusion leads — critical for through-hole wave soldering quality.
450–550 ms/FOV with reliable, long-term operation — sized for wave soldering line throughput without becoming the bottleneck.
Wave-soldered and double-sided assemblies combine tall THT components, dense SMT, and joints on both faces — the hardest mix for any single-pass inspection system.
VS7300 reconstructs full 3D height on both sides in a single pass — measuring joints and components that flat 2D AOI cannot reliably judge after wave soldering.
VS7300 combines 3D positioning, ultra-high range restoration, and specialized DIP joint algorithms to deliver reliable inspection for the most challenging wave-soldered and double-sided assemblies.
3D positioning avoids interference from silk-screen color changes, PCB surface variation, and component material differences — effectively solving the positioning problem on wave-soldered boards.
A gantry structure designed for wave soldering achieves ultra-high clearance, combined with industry-leading high-range 3D reconstruction technology for large THT components.
Purpose-built algorithms for manually and machine-inserted DIP solder joint inspection precisely measure pin heights and effectively control missing-pin defects.
An intelligent factory solution for monitoring and centralized management of production data — improves both quality and overall efficiency.
Real-time quality monitoring with timely feedback of abnormal conditions — prevents batch defects before they propagate down the line.
Only one side needs a barcode — the system automatically binds the test results from both sides for full traceability of every assembly.
VS7300 is configured for double-sided 3D AOI with 12MP or 21MP cameras (selected at point of order).
| Specification | VS7300 |
|---|---|
| Image System | |
| Camera | 12MP / 21MP industrial camera |
| Resolution | 12MP: 15µm · 21MP: 10µm |
| FOV | 60 × 45mm (12MP, 15µm) · 50 × 40mm (21MP, 10µm) |
| Lighting | 4-color programmable ring-shape LED (RGBW) |
| Height measurement | Structured grating × 4 on each side |
| Movement Structure | |
| X/Y movement | Dual AC Servo drive |
| Width adjustment | Automatic |
| Transport type | Belt |
| Board loading direction | Left → right or right → left (select at point of order) |
| Fixed rail | Front rail |
| Hardware Configuration | |
| Operating system | Windows 11 |
| Communication | Ethernet, SMEMA |
| Power requirement | Single phase 220V, 50/60Hz, 8A, 1.8kW |
| Air requirement | 0.4–0.6 MPa |
| Conveyor height | 900 ± 20mm |
| Equipment dimensions | L1200 × D1620 × H1610mm (without tower light) |
| Equipment weight | 1250 kg |
| PCB Handling | |
| PCB size | 50 × 50 – 510 × 510mm (up to 820 × 510mm in multiple sections) |
| Thickness | ≤ 6.0mm |
| Warping | ± 3.0mm |
| Component clearance | Top 30–65mm adjustable · Bottom 30–50mm adjustable |
| Clamping edge | 3.0mm |
| PCB weight | ≤ 8.0 kg |
| Inspection Categories | |
| Component defects | Wrong part, missing, polarity, offset, flip, damage, IC pin bending, IC lifting, foreign object, tombstone, etc. |
| Solder paste defects | Missing pin, solder hole, no solder, insufficient/excess solder, no protrusion lead, bridge, open soldering, etc. |
| Inspection component | Chip: 03015 and above (3D) · LSI: 0.3mm pitch and above · Others: odd-shape components |
| Max height range | 35mm (15µm resolution) |
| Inspection speed | 450–550 ms / FOV |
| Service & Support (NETA Trading) | |
| US distributor | NETA Trading LLC · Lake Bluff, IL |
| Installation & training | On-site installation, commissioning, and operator training |
| Live demo | Lake Bluff, IL · Remote demo available — subject to current equipment availability in the demo center. |
Configuration and specifications subject to change — contact us to confirm for your line.
VS7300 is the post-wave-soldering inspection station — placed after the wave solder oven to catch THT defects, and again as final inspection at end-of-line to verify both sides of the assembly before shipping.
Inspect THT solder joints and SMT components after the wave solder oven — catch missing pins, insufficient solder, bridges, and blowholes.
Single pass inspects both top and bottom of the PCBA — final QC before packaging and shipping.
3D + AI + color algorithms handle both SMT components and through-hole soldering on the same machine.
Supports boards up to 820 × 510mm in multi-section mode — sized for industrial wave-soldered assemblies.
Tell us about your post-wave line and defect priorities — we'll help you size the VS7300 for your throughput.